(1)This layer is used to make the stencil with punching holes, and the holes in the stencil correspond to the solder joints of the SMD devices on the printed circuit board.
This is to help the device be soldered on the PCB, and the size of the Paste mask is the same as the size of the pads. (2)When soldering surface mount devices, first cover the stencil on the printed circuit board (corresponding to the pads on the actual PCB), then print the solder paste, and then scrape off the excess solder paste with a blade, and finally remove the steel sheet.
In this way, the solder paste is added to the pad of the SMD device, and then the SMD device is attached to the solder paste, and finally, the soldering of the SMD device is completed by a reflow soldering machine. (3)In the Altium Designer software, the paste mask layer data of the PCB is generated based on the data of the solder mask layer.
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